MEMORY RESPONSE ON THERMOELASTIC BEHAVIOUR WITH TEMPERATURE DEPENDENT MATERIAL MODULI UNDER MECHANICAL STRIP LOAD
- 作者: Seikh A.1, Shaw S.2, Pal (Sarkar) S.1
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隶属关系:
- Department of Mathematics, Indian Institute of Engineering Science and Technology
- Department of Mathematics Dinabandhu Andrews College
- 期: 卷 63, 编号 2 (2023)
- 页面: 327
- 栏目: Mathematical physics
- URL: https://edgccjournal.org/0044-4669/article/view/664896
- DOI: https://doi.org/10.31857/S0044466923020035
- EDN: https://elibrary.ru/BREOGK
- ID: 664896
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详细
Temperature of the medium has a significant impact on the deformation and stress distribution into the medium. Material moduli is another key component that determines the deformation of the structural element. The present paper deals with the thermal memory response on stress and temperature fields in an isotropic medium. The material moduli of the medium are considered to be varying with temperature. Consequently, the classical heat conduction law is replaced by the memory dependent generalized theory of heat conduction. Analytical solutions of the field functions are obtained in the integral transform domain. The variations of the field functions in the space-time coordinate system are displayed graphically for different empirical constants and kernel functions.
作者简介
Aktar Seikh
Department of Mathematics, Indian Institute of Engineering Science and Technology
Email: soumen@rediffmail.com
Howrah, 711103, Shibpur
Soumen Shaw
Department of Mathematics Dinabandhu Andrews College
Email: soumen@rediffmail.com
Kolkata, 700084, Kolkata
Smita Pal (Sarkar)
Department of Mathematics, Indian Institute of Engineering Science and Technology
编辑信件的主要联系方式.
Email: soumen@rediffmail.com
Howrah, 711103, Shibpur
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