Barrier Layers Based on Refractory Metals in Contacts of High Temperature Thermoelements

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Abstract

An electrochemical method is proposed for forming contacts to high-temperature thermoelements with barrier layers based on refractory metal alloys. The contacts are intended for thermoelements with operating temperatures of up to 900 K. The barrier layers had a specific resistance of no more than 15.3 × 10–8 Ohm × m, and a specific contact resistance of no more than 1.5 × 10–9 Ohm m2. The best results were obtained for barrier layers based on Mo–Ni alloy with a Mo content of 36.5 wt. %. Ag films obtained by electrochemical deposition were used as a commutation layer in the contacts. It has been established that the contacts are thermally stable at the limiting operating temperatures of thermoelements and have an adhesive strength of at least 10.3 MPa.

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About the authors

E. P. Korchagin

National Research University of Electronic Technology

Author for correspondence.
Email: eg.ad2013@yandex.ru
Russian Federation, Moscow

Yu. I. Shtern

National Research University of Electronic Technology

Email: eg.ad2013@yandex.ru
Russian Federation, Moscow

I. N. Petukhov

National Research University of Electronic Technology

Email: eg.ad2013@yandex.ru
Russian Federation, Moscow

M. Yu. Shtern

National Research University of Electronic Technology

Email: eg.ad2013@yandex.ru
Russian Federation, Moscow

M. S. Rogachev

National Research University of Electronic Technology

Email: rmaks1988@yahoo.com
Russian Federation, Moscow

R. M. Ryazanov

National Research University of Electronic Technology; Technological Centre Scientific-Manufacturing Complex

Email: eg.ad2013@yandex.ru
Russian Federation, Moscow; Moscow

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Supplementary files

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2. Fig. 1. SEM images of the surface of the films formed on Bi0.4Sb1.6Te3 samples.

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3. Fig. 2. SEM image of the spall of Bi0.4Sb1.6Te3 (a) and GeTe (b) samples with formed Ni-Mo/Ag contact system after annealing.

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4. Fig. 3. SEM image of element-by-element mapping of the chipped Bi0.4Sb1.6Te3 sample with formed Ni-Mo/Ag CW after annealing at 600 K: (a) Ag, (b) Ni, (c) Mo, (d) Te, (e) Sb, (f) Bi.

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5. Fig. 4. SEM image of the element-by-element mapping of the GeTe sample spall with the formed Ni-Mo/Ag CW after annealing at 900 K: (a) Ni, (b) Ag, (c) Te, (d) Ge.

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